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February 6, 2007

TI CEO Rich Templeton to Discuss Wireless Strategy with Investors at 3GSM World Congress

TI CEO Rich Templeton to Discuss Wireless Strategy with Investors at 3GSM World CongressLive Webcast at www.ti.com/ir

February 13, 2007, 9-9:45 a.m. Central European Time

DALLAS (Feb. 6, 2007) – Texas Instruments Incorporated (TI) (NYSE:TXN) announced that TI President and Chief Executive Officer Rich Templeton will speak at a TI-sponsored investor meeting held during the 3GSM World Congress in Barcelona, Spain, on Tuesday, February 13, beginning at 9 am Central European Time (2 am Central Standard Time). Templeton, along with Senior Vice President Greg Delagi and Vice President Alain Mutricy, will field questions from analysts and investors, as well as discuss TI's business outlook and its semiconductor strategy for the cell phone market and how the company uses its capabilities in DSP and analog to position it for growth across a range of wireless opportunities.

The audio webcast can be accessed live through the Investor Relations section (http://www.ti.com/ir) of TI's website. Archived replays are available for 1 week.

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Texas Instruments Incorporated provides innovative DSP and Analog technologies to meet our customers’ real world signal processing requirements. In addition to Semiconductor, the company includes the Education Technology business. TI is headquartered in Dallas, Texas, and has manufacturing, design or sales operations in more than 25 countries

Texas Instruments is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web at www.ti.com.